Avishtech in the News
June 10, 2021 | Judy Warner | Altium Newsletters
Until now, simulation software hasn’t considered PCB manufacturability. Furthermore, the unintentional consequences that result from the lack of this information frequently leads to costly failures. Equipped with decades of academic rigor and industry experience, Keshav and Tarun Amla of Avishtech set out to solve this problem with their Gauss 2D and Gauss Stack software. In this interview, they discuss why they developed this software and what solutions they can now offer design engineers.
May 26, 2021 | Kella Knack | Microwaves & RF
Today’s high-data-rate, high-frequency designs create new challenges for printed-circuit-board design.
April 22, 2021 | Roberto Frazzoli | EDACafe
Selecting the right construction for a PCB stack and meeting the tight loss budget of PCB transmission lines are major challenges for designers and manufacturers of high-frequency printed circuit boards. According to Avishtech – a young San Jose-based provider of innovative EDA solutions – traditional EDA tools fall short of needs in those two areas, often leading to a trial-and-error development process that translates into long design cycles and increased costs.
April 20, 2021 | Judy Warner | Altium
Tarun Amla and Keshav Amla from Avishtech join us in today’s OnTrack Podcast episode.
April 19, 2021 | Sanjay Gangal | EDACafe
Keshav Amla of Avishtech is interviewed by Sanjay Gangal of EDACafe
March 22, 2021 | Mike Buetow | PCD&F/Circuits Assembly
Design engineers are paying close attention to materials. It’s not just about the routing anymore. Keshav Amla and Tarun Amla are founder and CEO and cofounder and CTO, respectively, of Avishtech, a San Jose, CA-based developer of simulation and design software, specifically stack-up and 2D field solvers. They discuss how their signature software enables better board design and how it came to be endorsed by Lee Ritchey, one of the leading experts in signal integrity and PCB design.
March 17, 2021 | Dave Maliniak | Microwaves & RF
Keshav Amla, founder and CEO of Avishtech, an EDA startup, discusses how the company’s PCB simulation and stackup tools can close the gap between PCB design and manufacturability.
Microwave Journal - Modeling Transmission Lines and Board Design Using a Unified Simulation Approach
February 10, 2021 | Microwave Journal
With data rates exceeding 56 Gbps/channel and operating frequencies moving into the mmWave regime for 5G applications, accurate modeling of transmission lines is becoming increasingly important. The lack of accurate models and data leads to costly errors that not only cause long delays but also result in signal Integrity and reliability issues. This increased complexity necessitates a design process that integrates Signal Integrity analysis, stack-up design, material selection, and thermal/mechanical performance and reliability. This webinar highlights the many pitfalls associated with the current process of building multiple revisions of Test Vehicles and outlines a holistic approach to the design process, using Gauss 2D and Gauss Stack from Avishtech’s Gauss suite of products, that would not only provide a Robust design but also shrink the time to market for new technologies.
Microwave Journal - PCB Simulation Suite Improves Design Performance, Reduces Development Time and Cost
November 13, 2020 | Microwave Journal
As the industry shifts toward higher speed designs and next-generation wireless communications, insertion loss and the ability to predict it have become constraints to achieving higher speeds. While the industry has been working on increasing data rates through new signaling techniques, loss modeling leaves much to be desired, requiring multiple revisions of signal integrity (SI) test vehicles – a very expensive and time-consuming process that may take many months before completing loss validation.
September 1, 2020 | Microwave Journal
Taking a multidisciplinary approach to building a fully integrated, materials-driven EDA environment
August 13, 2020 | I-Connect007 Editorial Team | I-Connect007
It has been a crazy year with lots of ups and downs. But within the clouds, we’ve seen plenty of silver linings, too. Case in point: Avishtech, a brand-new company lead by founder and CEO Keshav Amla. (You may be familiar with his father, Tarun Amla, a veteran PCB materials technologist who is now with ITEQ.) We recently caught up with Keshav and asked him to discuss his company’s simulation tools, his plans for the company, and what it’s like launching a company in this “new normal.”