Gauss Stack – PCB Warpage Prediction

PCB Warpage

With asymmetric designs, especially, board level warpage is a serious problem – boards that are significantly warped cannot even make it through assembly, let alone be deployed into the field. The primary driver behind this warpage behavior is asymmetry in the stackup – this asymmetry can come from using different dielectric layers, different copper foils (different weights/thicknesses, or even simply different roughness values), or even just different retained copper percentages (a byproduct of different designs on each layer) near the top and bottom of your PCB stackup.

Warpage Prediction with Gauss Stack

Gauss Stack allows a user to predict warpage over the dimensions of a board during lamination and reflow, without any additional input from the user. By seeing this warpage output, a user can then iterate through different constructions and/or materials to a design that still meets the thickness and material requirements that necessitated the asymmetry while also minimizing warpage. With Gauss Stack, a user can avoid this problem at the outset during the stackup design stage, rather than simply observing it many months into the design process, while building prototype test vehicle boards.

Predict PCB Warpage with Gauss Stack Today!