With an extensive built-in vendor-specific dielectric materials library, Gauss SI allows you to specify each layer of a PCB stackup within seconds. This library is fully integrated with the thermomechanical reliability and electromagnetic / signal integrity simulations, so there is no additional input required from the user.
With a few quick clicks, a user can design an entire stackup of arbitrary size, in minutes or less, by simply specifying the Signal, Plane, and Mixed layers of copper and specifying the dielectric prepreg and core layers, a process made trivially easy with the built-in libraries, as well as the ability to add custom materials to a user-defined custom materials library.
A user can also take advantage of Gauss Stack’s predefined copper library, which contains thicknesses and Rz roughness values for available copper ranging from 1.5 µm copper for SLP to 6 ounce heavy copper. The Rz values, which are used for the glass stop and resin starvation analysis, are those typically available for a chosen copper weight/thickness.
Build Robust, Reliable, and High Performance Stackups with Gauss Stack Today!