Stackup Synthesis – Manufacturability, Reliability, and Signal Integrity

$9,500.00

Gauss Stack will be used to synthesize the ideal stackup for your requirements and constraints. Thermomechanical and Electromagnetic Simulations through Gauss Stack and Gauss 2D will be used to optimize a stackup, in terms of Glass Stop / Resin Starvation, Warpage, Plated Through Hole Reliability, Microvia Reliability, Solder Joint Reliability, and Transmission Line Signal Integrity. Any or all of these assessments are included in the base price. Simply select which ones are relevant and provide the relevant inputs. In addition to an expert-authored report, you will be entitled to a web meeting to go through the results (and can also have one prior to the Synthesis, should you desire).

SKU: SIM068000 Category:

Material Choices

Either specify which dielectric materials or vendors you would like considered or select the checkbox to have these chosen for you based on your other requirements.

  • Consider the Following Materials *

Synthesis Menu

Select from the following which assessments you would like considered for the stackup synthesis.

  • Thermomechanical Properties can be provided for further modeling work outside of the Gauss framework (e.g. for FEA simulations). Included in the base price.

  • Stackup will be optimized to minimize warpage (for asymmetric stackups). Included in the base price.

  • Stackup will be optimized to minimize glass stop issues, if present. Included in the base price.

  • Stackup will be assessed for plated through hole reliability in reflow and thermal cycling conditions.

PTH Inner Diameter (mils) *

PTH Outer Diameter (mils) *

PTH Pitch (mm) *

PTH Reflow Temperature (°C) *

  • Stackup will be assessed for microvia reliability in reflow and thermal cycling conditions.

Microvia Inner Diameter (mils) *

Microvia Outer Diameter (mils) *

Microvia Pitch (mm) *

Microvia Reflow Temperature (°C) *

  • Stackup will be assessed for solder joint reliability

Solder Material *

Component Package *

Component Length (mm) *

Component Width (mm) *

Bond Pad Length (mm) *

Bond Pad Width (mm) *

Package Thickness (mm) *

Solder Joint Height (µm) *

Thermal Excursion Lower Bounds (°C) *

Thermal Excursion Upper Bounds (°C) *

Elastic Modulus - Component (GPa) *

CTE - Component (PPM/°C) *

  • Transmission lines will be specified to meet impedance requirements and will be assessed for loss, RLGC, effective dielectric properties. Frequency-Dependent properties will be provided, along with S-Parameters.

Loss Budget(s) *

You can specify your loss budgets and these will be considered in the determination of what constitutes the ideal stackup for your requirements. You can alternatively specify these in a generic or sample stackup that you upload here.

Transmission Line Impedance Requirements *

It is probably easiest to specify impedance targets for each transmission line in a generic or sample stackup you upload, but, alternatively, you can specify your impedance requirements per layer here and the transmission lines will be synthesized accordingly in each considered stackup.

Additional Information

Please include any additional requirements or information for the stackup synthesis. You can also rank the different analyses in terms of priority.

  • *

Product total

Options total

Grand total

Gauss Stack will be used to synthesize the ideal stackup for your requirements and constraints. Thermomechanical and Electromagnetic Simulations through Gauss Stack and Gauss 2D will be used to optimize a stackup, in terms of Glass Stop / Resin Starvation, Warpage, Plated Through Hole Reliability, Microvia Reliability, Solder Joint Reliability, and Transmission Line Signal Integrity. Any or all of these assessments are included in the base price. Simply select which ones are relevant and provide the relevant inputs. In addition to an expert-authored report, you will be entitled to a web meeting to go through the results (and can also have one prior to the Synthesis, should you desire).