Stackup Analysis – Manufacturability, Reliability, and Signal Integrity

The following assessments will be conducted for your submitted stackup.

• Thermomechanical Properties *

  Thermomechanical Properties can be provided for further modeling work outside of the Gauss framework (e.g. for FEA simulations). Included in the base price.

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  Manufacturability Assessment (Glass Stop & Filler Damming) *

  Stackup will be assessed for glass stop and filler damming issues. If present, an option will be presented that has been optimized to minimize these issues. Included in the base price.

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  Reliability Assessment (Warpage, Plated Through Hole, Microvia Reliability) * $500.00

  Stackup will be assessed for Warpage, Plated Through Hole Reliability, Microvia Reliability.

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  Impedance & Loss Assessment (includes S-Parameters and Uncertainty Analysis) * $500.00

  Stackup's transmission lines will be synthesized and/or analyzed for target impedances and assessed for insertion loss, along with S-Parameters and Uncertainty Analysis.

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  Skew Assessment * $1,500.00

  Stackup will be assessed for fiber weave skew.

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  Layer Shrinkage / Dimensional Stability During Lamination * $2,000.00

  Stackup will be assessed for layer-by-layer shrinkage / dimensional movement.