Welcome to the Avishtech Blog!
Welcome to our blog site. Our blogs are meant to be informative, educational, and, above all, take the “technology high road” to provide real insights that will help you successfully execute your designs. Within our blogs, in addition to providing information on our toolsets and the various capabilities found within them, we will, both ourselves and through various industry experts, focus on building the all-too-critical bridge between the worlds of engineering theory and simulation and the real world.
We welcome any questions, input or comments you may have regarding our blogs. You may also suggest blog topics to us at info@avishtech.com. Thanks in advance for your time and consideration and we hope you enjoy these posts!
—Keshav Amla, Founder and CEO, Avishtech
Dielectric and Insertion Loss Measurements Part 2: Ground Plane Losses – The Bridge Between Insertion Loss Measurement and Simulation
SITV Method This involves building a Signal Integrity Test Vehicle (8-10 layers) and measuring insertion loss for Single ended striplines and differential pairs. If extraction of DK and DF is desired, a 2D solver is used to simulate the conductor loss, and a fit to...
Dielectric and Insertion Loss Measurement Part 1: The Problem in High Frequency, High Data Rate Designs
As onboard data rates have increased, the industry has run up against challenges of ever shrinking insertion loss budgets on transmission lines. There has been a lot of work done to recover the signal even after the amplitude has degraded by >=28dB; techniques such...
The Long-Term Consequences of the Worldwide Chip Shortage
At the beginning of COVID in 2019 and the subsequent restrictions and challenges associated with it, it wasn’t clear what the long-term consequences of the pandemic would be; how long they would last; the extent of their spread and how dramatic their impact would be....
Key Manufacturing Issues Designers Need to Understand
As noted in numerous areas on the Avishtech website as well as tech journals, key conferences and a variety of other resources, today’s high frequency, high data rate designs necessitate the need for a much closer understanding of the factors between the design and...
Predicting Skew for High Frequency, High Data Rate Designs
Controlling glass weave-induced skew has been a longtime concern for the PCB design industry. Initially, there was no method for doing so and, then as the issue and the problems associated with it evolved, some advancements were made. But, as has been noted on our...
Accounting for Copper Surface Roughness in High Data Rate, High Frequency Designs
As noted on our website as well as various platforms across the industry, one of the biggest challenges to successfully implementing high frequency, high data rate designs is controlling loss. There are a variety of ways/areas in which loss can be manifested and...
Glass Stop & Resin Starvation – The Main Culprits Behind CAF Failure
As we increase our focus on spanning the gap between PCB design and fabrication, on the design side, we start to come up against fabrication terms and technical issues with which we may not be that familiar. This is the first in a series of blogs that will address how...
How Dielectric Materials Properties and Characteristics Affect High Frequency, High Data Rate Designs
When it comes to designing high frequency, high data rate products, there are a number of ways in which the laminate you choose for your product can affect its performance. As we continue to go up the speed curve, these parameters become more important.